光阻和基材附着由光阻膜顺着铜表面流动而达成，加热降低光阻的黏度来增强干膜的流动性，增加对铜表面填充加压将流动状态的光阻挤上铜表面，两者之间产生附着力。
The photoresist and substrate adhesion are achieved by the photoresist film flowing along the copper surface. Heating reduces the viscosity of photoresist to enhance the fluidity of the dry film, increasing the filling pressure on the copper surface to squeeze the flowing photoresist onto the copper surface, and the adhesion between the two is produced.
铜箔的影响（影响干膜的附着力及填充力）
Influence of copper foil (influence on adhesion and filling force of dry film)
影响因素：板面水点、氧化、板面残渣、凹痕、织布纹、手印、油脂、铜箔厚度、铜箔重量、铜箔进板温度
Influencing factors: water point, oxidation, residue, dent, weaving pattern, fingerprint, grease, thickness of copper foil, weight of copper foil, temperature of copper foil entering the board
压膜参数的影响
The influence of pressure film parameters
温度过高：起皱、出现气泡、干膜部分v保定平面设计培训  防撞墙模具 防撞墙模具 防撞护栏模具 大棚遮阳网 遮阴网 位置变薄、因干透而减低附着力
Too high temperature: wrinkling, bubbles, thinning of dry film part, reduction of adhesion due to dry through
温度过低：低附着力、低填充能力
Low temperature: low adhesion, low filling capacity
贴膜速度过快：附着力低、填充能力低
Too fast film application: low adhesion and filling capacity
贴膜速度过慢：起皱，干膜部分位置变薄、因干透而减低附着力
Too slow film application speed: wrinkling, thinning of dry film part, and reduction of adhesion due to drying out